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- NSN 8030-01-629-4132
8030-01-629-4132
Description: Thermal Insulating Compound
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Export Restrictions
Any part(s) quoted or sold by MilSpec.parts and re-sold (to a third party) CANNOT be sold to a USA embargoed country, company, entity, or person(s). Depending on the ECCN, these commodities may require export license or exception. Diversion contrary to U.S. law is prohibited. Unless otherwise noted, this sale, order or quote may include Munitions List Items (MLI) or Commerce Controlled List Items (CCLI). MLI/CCLI property is controlled by the US Government and in many cases cannot be transferred (exported, sold or given) to a foreign country, a non-US Citizen/National or a non- Permanent US Resident without a valid State/Commerce Department export authorization. It is the responsibility of (the Purchaser) to determine what the applicable requirements may be, to obtain all necessary authorizations, licenses or approvals and are subject to both review and acceptance by MilSpec.parts. The use, disposition, export and re-export of the property covered or included in this sale, order or quote is subject to the provisions of law referenced in End-Use Certificate DLA form 1822, DEC 2001, including, but not limited to, the Arms Export Control Act (22 USC 2751 et seq.); Export Administration Act of 1979 (50 USC App. 2401 et seq.) as contained under Executive Order 12924; International Traffic in Arms Regulations (22 CFR 120 et seq.); Export Administration Regulations (15 CFR 730 et seq.); Foreign Assets Control Regulations (31 CFR 500 et seq.) and the Espionage Act (18 USC 793 et seq.)
8030-01-629-4132 Properties
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NSN:8030-01-629-4132
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Description:Thermal Insulating Compound
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Shelf Life:N/A
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DEMIL:NO
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UOM:--
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Physical Form:Solid
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Usage Design:For extremely low thermal impedance at thinner bondline thicknesses (sometimes below 1 mil)
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Curing Method:Heat
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Part Name Assigned By Controlling Agency:Thermal grease
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Special Features:Silicone based thermal grease that conducts heat between hot coponent and a heat sink or enclosure; fills interface variable tolerances in electronics assemblies and heat sink applications; non curing, dispensable, highly conformable materials require no cure cycle, mixing or refrigeration; thermally stable and require virtually no compressive force to deform under assembly pressure; meet the need for high power applications requiring material with bond line thickness and high conductivity; ideal for rework and field repair situations; operating temp range-minus 55c to 200c
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Color:Gray, light
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Material:Silicone