5961-00-977-6173

Description: Semiconductor Device Set

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We are commited to quality and satisfaction as a certified supplier in the aerospace and military industries.

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  • QC Inspection prior to shipping
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MILSPEC: Semiconductor Devices And Associated Hardware

 Export Restrictions

Any part(s) quoted or sold by MilSpec.parts and re-sold (to a third party) CANNOT be sold to a USA embargoed country, company, entity, or person(s). Depending on the ECCN, these commodities may require export license or exception. Diversion contrary to U.S. law is prohibited. Unless otherwise noted, this sale, order or quote may include Munitions List Items (MLI) or Commerce Controlled List Items (CCLI). MLI/CCLI property is controlled by the US Government and in many cases cannot be transferred (exported, sold or given) to a foreign country, a non-US Citizen/National or a non- Permanent US Resident without a valid State/Commerce Department export authorization. It is the responsibility of (the Purchaser) to determine what the applicable requirements may be, to obtain all necessary authorizations, licenses or approvals and are subject to both review and acceptance by MilSpec.parts. The use, disposition, export and re-export of the property covered or included in this sale, order or quote is subject to the provisions of law referenced in End-Use Certificate DLA form 1822, DEC 2001, including, but not limited to, the Arms Export Control Act (22 USC 2751 et seq.); Export Administration Act of 1979 (50 USC App. 2401 et seq.) as contained under Executive Order 12924; International Traffic in Arms Regulations (22 CFR 120 et seq.); Export Administration Regulations (15 CFR 730 et seq.); Foreign Assets Control Regulations (31 CFR 500 et seq.) and the Espionage Act (18 USC 793 et seq.)

5961-00-977-6173 Properties

  • NSN:
    5961-00-977-6173
  • Description:
    Semiconductor Device Set
  • Shelf Life:
    N/A
  • DEMIL:
    DEMIL/MLI
  • UOM:
    1 SE
  • Inclosure Material:
    Glass all semiconductor device diode
  • Overall Length:
    0.120 inches all semiconductor device diode and 0.200 inches all semiconductor device diode
  • Terminal Length:
    0.500 inches all semiconductor device diode
  • Overall Diameter:
    0.060 inches all semiconductor device diode and 0.090 inches all semiconductor device diode
  • Function For Which Designed:
    Rectifier
  • End Application:
    Aircraft, phantom f-4; fire control system, missile mk 74 (fcs); sonar sets, an/bqs-14a/15; aircraft, stratofortress b-52; ship, ohio class ssn (trident); submarine miscellaneous sonar and adp systems; communication control angsc37; sturgeon class ssn (637); submarine communications and antenna systems; trident exterior communications
  • Internal Configuration:
    Junction contact all semiconductor device diode
  • Joint Electronic Device Engineering Council/jedec/case Outline Designation:
    Do-35 all semiconductor device diode
  • Internal Junction Configuration:
    Pn all semiconductor device diode
  • Component Function Relationship:
    Matched
  • Component Name And Quantity:
    4 semiconductor device diode
  • Mounting Method:
    Terminal all semiconductor device diode
  • Features Provided:
    Hermetically sealed case
  • Criticality Code Justification:
    Feat
  • Semiconductor Material:
    Silicon all semiconductor device diode
  • Voltage Rating In Volts Per Characteristic:
    70.0 repetitive peak reverse voltage all semiconductor device diode
  • Current Rating Per Characteristic:
    200.00 milliamperes forward current, average absolute all semiconductor device diode
  • Special Features:
    Weapon system essential
  • Terminal Type And Quantity:
    2 uninsulated wire lead all semiconductor device diode
Manufacturers and Part Numbers
Part Number
Brand
910768
Gilbert Engineering Co /on
JAN1N483B
Military Specifications
NDX1162
Micro Uspd
PD6173
Pd & E Electronics
Major Organizational Entities (MOE)
Entity
MOE Code
MOE Rule
PICA
DSOR
User:
DEPARTMENT OF THE AIR FORCE Dept. of the Air Force
MOE_CD:
DF
MOE_RL:
FXGX
PICA:
GX
DSOR:
User:
DEPARTMENT OF THE NAVY Dept. of the Navy
MOE_CD:
DN
MOE_RL:
N9BN
PICA:
GX
DSOR:
User:
BRAZIL Brazil
MOE_CD:
YA
MOE_RL:
YA01
PICA:
YA
DSOR:
User:
REPUBLIC OF KOREA Republic of Korea
MOE_CD:
ZH
MOE_RL:
ZH01
PICA:
ZH
DSOR:
Part Identification
INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
20590
FIIG:
A110A0
Concept No.:
App. Key:
F
Cond. Code:
1
Status:
A
Material and Special Handling
Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
A
ESD:
B
ESD:
B
MMAC:
---
CRITL:
Y
Hazmat (HMIC): N
Indicates there is no data in the hmirs and the nsn is in a fsc not generally suspected of containing hazardous materials.
Precious Metals (PMIC): A
Item does not contain precious metal.
Criticality (CRITL): Y
The item does not have a nuclear hardened feature but does have other critical feature(s) such as tolerance, fit restrictions or application.
Packaging and Dimensions
Package Size
Package Weight
Part Weight
Part Dimensions (approx.)
Pack Size:
--
Pack Weight:
0.1000lbs
Item Weight:
--
Item Dim:
--
Container
OPI
SPI No.
SPI Rev.
Container:
XX
OPI:
M
SPI No.:
SPI Rev.:
SPC Mkg.
LVL A
LVL B
LVL C
SPC Mkg.:
ZZ
LVL A:
Q
LVL B:
Q
LVL C:
6
CUSH
MOP
CATEG.
PRESS MAT
CUSH:
XX
MOP:
ZZ
CATEG.:
69F0
PRESS MAT:
XX
WRAP MAT
ICQ
THK
TOS
UCL
WRAP MAT:
XX
ICQ:
XXX
THK:
X
TOS:
UCL:
Packaging Code Definitions
LVL A Code (LVL_A):Q
Packing shall be accomplished in accordance with table c.Ii for the packing level specified. closure, sealing and reinforcement shall be in accordance with applicable specification for shipping container.
LVL B Code (LVL_B): Q
Packing shall be accomplished in accordance with table c.Ii for the packing level specified. closure, sealing and reinforcement shall be in accordance with the appropriate shipping container specification.
Procedure Indicator Code (OPI): M
All packaging data is mandatory for compliance and no substitutions are permitted. fast packs should be included in this category.
Special Markings Code (SPC MKG): ZZ
Special requirements.
Method of Preservation (MOP): ZZ
See j.4.1.B.
Cushion Material (CUSH): XX
Preservation Material (PRESS MAT): XX