5961-00-016-4951

Description: Semiconductor Device Set

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MILSPEC: Semiconductor Devices And Associated Hardware

 Export Restrictions

Any part(s) quoted or sold by MilSpec.parts and re-sold (to a third party) CANNOT be sold to a USA embargoed country, company, entity, or person(s). Depending on the ECCN, these commodities may require export license or exception. Diversion contrary to U.S. law is prohibited. Unless otherwise noted, this sale, order or quote may include Munitions List Items (MLI) or Commerce Controlled List Items (CCLI). MLI/CCLI property is controlled by the US Government and in many cases cannot be transferred (exported, sold or given) to a foreign country, a non-US Citizen/National or a non- Permanent US Resident without a valid State/Commerce Department export authorization. It is the responsibility of (the Purchaser) to determine what the applicable requirements may be, to obtain all necessary authorizations, licenses or approvals and are subject to both review and acceptance by MilSpec.parts. The use, disposition, export and re-export of the property covered or included in this sale, order or quote is subject to the provisions of law referenced in End-Use Certificate DLA form 1822, DEC 2001, including, but not limited to, the Arms Export Control Act (22 USC 2751 et seq.); Export Administration Act of 1979 (50 USC App. 2401 et seq.) as contained under Executive Order 12924; International Traffic in Arms Regulations (22 CFR 120 et seq.); Export Administration Regulations (15 CFR 730 et seq.); Foreign Assets Control Regulations (31 CFR 500 et seq.) and the Espionage Act (18 USC 793 et seq.)

5961-00-016-4951 Properties

  • NSN:
    5961-00-016-4951
  • Description:
    Semiconductor Device Set
  • Shelf Life:
    N/A
  • DEMIL:
    NO
  • UOM:
    1 PR
  • Inclosure Material:
    Glass all semiconductor device diode
  • Overall Length:
    0.230 inches all semiconductor device diode and 0.300 inches all semiconductor device diode
  • Terminal Length:
    1.000 inches all semiconductor device diode
  • Overall Diameter:
    0.108 inches all semiconductor device diode and 0.140 inches all semiconductor device diode
  • Internal Configuration:
    Junction contact all semiconductor device diode
  • Joint Electronic Device Engineering Council/jedec/case Outline Designation:
    Do-14 all semiconductor device diode
  • Internal Junction Configuration:
    Pn all semiconductor device diode
  • Component Function Relationship:
    Matched
  • Component Name And Quantity:
    2 semiconductor device diode
  • Mounting Method:
    Terminal all semiconductor device diode
  • Semiconductor Material:
    Silicon all semiconductor device diode
  • Voltage Rating In Volts Per Characteristic:
    225.0 repetitive peak reverse voltage all semiconductor device diode
  • Current Rating Per Characteristic:
    15.00 amperes peak forward surge current and 400.00 milliamperes forward current, average absolute all semiconductor device diode
  • Terminal Type And Quantity:
    2 uninsulated wire lead all semiconductor device diode
Manufacturers and Part Numbers
Part Number
Brand
2553316
Navair And Navsea Managed
Major Organizational Entities (MOE)
Entity
MOE Code
MOE Rule
PICA
DSOR
User:
DEPARTMENT OF THE NAVY Dept. of the Navy
MOE_CD:
DN
MOE_RL:
N9BN
PICA:
GX
DSOR:
User:
ITALY Italy
MOE_CD:
ZR
MOE_RL:
ZR01
PICA:
ZR
DSOR:
User:
TURKEY Turkey
MOE_CD:
ZW
MOE_RL:
ZW01
PICA:
ZW
DSOR:
Part Identification
INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
20590
FIIG:
A110A0
Concept No.:
App. Key:
F
Cond. Code:
1
Status:
A
Material and Special Handling
Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
U
ESD:
ESD:
MMAC:
---
CRITL:
X
Hazmat (HMIC): N
Indicates there is no data in the hmirs and the nsn is in a fsc not generally suspected of containing hazardous materials.
Precious Metals (PMIC): U
Precious metal content is unknown
Criticality (CRITL): X
The item does not have a nuclear hardened feature or any other critical feature such as tolerance, fit restriction or application.
Packaging and Dimensions
Package Size
Package Weight
Part Weight
Part Dimensions (approx.)
Pack Size:
--
Pack Weight:
--
Item Weight:
--
Item Dim:
--
Container
OPI
SPI No.
SPI Rev.
Container:
OPI:
SPI No.:
SPI Rev.:
SPC Mkg.
LVL A
LVL B
LVL C
SPC Mkg.:
LVL A:
LVL B:
LVL C:
CUSH
MOP
CATEG.
PRESS MAT
CUSH:
MOP:
CATEG.:
PRESS MAT:
WRAP MAT
ICQ
THK
TOS
UCL
WRAP MAT:
ICQ:
THK:
TOS:
UCL:
Packaging Code Definitions
LVL A Code (LVL_A):
LVL B Code (LVL_B):
Procedure Indicator Code (OPI):
Special Markings Code (SPC MKG):
Method of Preservation (MOP):
Cushion Material (CUSH):
Preservation Material (PRESS MAT):